Intel

Intel Xeon ® ® E-2314 Processor (8M Cache, 2.80 GHz). Processor family: Intel Xeon E, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16+1x4,2x8+1x4,1x8+3x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0,AVX-512. Intel® Turbo Boost Technology 2.0 frequency: 4.5 GHz, Maximum Enclave Size Support for Intel® SGX: 0.5 GB. Processor package size: 37.5 x 37.5 mm

Intel AXXRPFKSSD. Output interface: PCI. Connectivity technology: Wired

Intel Core i5-14400F. Processor family: Intel® Core™ i5, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 192 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express slots version: 4.0, 5.0. Processor package size: 45 x 37.5 mm. L2 cache: 9728 KB, Maximum internal memory: 192 GB

Intel Core i5-14400F. Processor family: Intel® Core™ i5, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 192 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express slots version: 4.0, 5.0. Processor package size: 45 x 37.5 mm. L2 cache: 9728 KB, Maximum internal memory: 192 GB

Intel Core i5-12400F. Processor family: Intel® Core™ i5, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM,DDR5-SDRAM. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express configurations: 1x16+1x4,2x8+1x4. Package type: Retail box. Processor package size: 45 x 37.5 mm

Intel ® NUC Rugged Chassis Element CMCR1ABB. Brand compatibility: Intel, Cabling technology: 10/100/1000, Ethernet LAN data rates: 10,100,1000 Mbit/s. Width: 10" (254 mm), Depth: 6" (152.4 mm), Height: 1.42" (36 mm). Export Control Classification Number (ECCN): EAR99. Thermal Design Power (TDP): 15 W, DC input voltage: 12~24 V. Additional headers: Front panel (PWR_SW, PWR_LED, RST, HDD_Act, 5V, 5Vsby, 3.3Vsby); Internal 2x2 power connector, Launch date: Q4'19, Status: Launched